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Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
60.60 Standard published
High-voltage direct current (HVDC) installations - System tests
60.60 Standard published
High-voltage direct current (HVDC) installations - System tests
60.60 Standard published
High-voltage direct current (HVDC) installations - System tests
60.60 Standard published
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
60.60 Standard published
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
60.60 Standard published
Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
60.60 Standard published
Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
60.60 Standard published
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
60.60 Standard published
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
60.60 Standard published
Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
60.60 Standard published
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
60.60 Standard published
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
10.99 New project approved
Semiconductor devices - Isolation for semiconductor devices - Part 1: Failure mechanisms and measurement methods to evaluate solid insulation for semiconductor devices
10.99 New project approved
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
40.60 Close of voting
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
40.60 Close of voting