Telefon: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Prodaja standarda: prodaja@iss.rs Seminari, obuke: iss-edukacija@iss.rs Informacije o standardima: infocentar@iss.rs
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Pretražite srpske, evropske i međunarodne standarde. Odredite organizaciju koja je donosilac standarda, izaberite oznaku standarda ili ključnu reč i završite željenu pretragu. Možete dodati i fazu u izradi standarda ili komitet/komisiju koja je izradila standard.

Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods

50.00 Evidentiranje podataka o definitivnom tekstu nacrta standarda

TC 86/SC 86C Saznaj više

Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module

40.60 Završetak javne rasprave

TC 47 Saznaj više

Semiconductor devices - Guidelines for reliability qualification plans - Part 4: Early failure assessment

30.60 Završetak izjašnjavanja o nacrtu komisije standarda

TC 47 Saznaj više

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

30.20 Početak izjašnjavanja o nacrtu komisije standarda

TC 47/SC 47D Saznaj više

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

60.00 Standard u postupku objavljivanja

TC 47/SC 47D Saznaj više

Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages

30.20 Početak izjašnjavanja o nacrtu komisije standarda

TC 47/SC 47D Saznaj više

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

30.60 Završetak izjašnjavanja o nacrtu komisije standarda

TC 47/SC 47D Saznaj više

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

20.99 Prednacrt standarda prihvata se kao nacrt standarda

TC 47/SC 47D Saznaj više

Semiconductor devices - Isolation for semiconductor devices - Part 1: Failure mechanisms and measurement methods to evaluate solid insulation for semiconductor devices

30.20 Početak izjašnjavanja o nacrtu komisije standarda

TC 47 Saznaj više

Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate

20.99 Prednacrt standarda prihvata se kao nacrt standarda

TC 47/SC 47D Saznaj više

Part model guideline for electronic-device packages - XML requirements

20.99 Prednacrt standarda prihvata se kao nacrt standarda

TC 47/SC 47D Saznaj više