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Eighteenth supplement
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Nineteenth supplement
60.60
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Twentieth supplement
60.60
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Twenty-first supplement
60.60
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Mechanical standardization of semiconductor devices - Part 2: Dimensions
60.60
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Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
60.60
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Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
60.60
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Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
60.60
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Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
60.60
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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
60.60
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Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
60.60
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Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
60.60
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Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
60.60
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Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
60.60
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Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
60.60
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Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
60.60
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Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
60.60
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Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
60.60
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