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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

60.60   Стандард објављен

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

60.60   Стандард објављен

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA

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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

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Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

60.60   Стандард објављен

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

60.60   Стандард објављен

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

60.60   Стандард објављен

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

60.60   Стандард објављен