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IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

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IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

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Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

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Test method of sound variation detection sensors for fire detection

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Semiconductor Devices - Part 16-XX: Microwave integrated circuits - Phase frequency detectors

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Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools

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Semiconductor Sensors - Semiconductor Magnetic Current Sensors for Basic and Reinforced Insulation

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Semiconductor devices - Part 14-14: Semiconductor sensors - Performance test method for capacitive fingerprint sensors

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Semiconductor devices - Part 14-15: Semiconductor sensors - Performance test method of dynamic vision sensors

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Semiconductor devices - Micro-electromechanical devices - Part 64: Test methods of Terahertz sensing antenna-coupled MEMS bolometer

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CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A

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Integration of automated driving and related electrified road infrastructure

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Rules for Steam Turbine Thermal Acceptance Tests - Part5 Steam Turbines in Combined Heat and Power (CHP) / District Heating (DH) Cycles

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Inductors - Near Magnetic and Electric Field Characterization

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Ferrite cores- Guidelines on dimensions and limits of surface irregularities - Part16: SQ-cores

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Specifications for particular types of winding wires – Part 94: Polyesterimide overcoated with polyamide-imide enamelled round copper wire, class 220

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Risk Analysis of Open Systems

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<em>Standardized Data Format for Mission Profiles</em>

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