Ревидиран
Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
ПОВУЧЕН
IEC 60352-5:2008 ED3
99.60
Повлачење ступило на снагу
22. 2. 2012.
ПОВУЧЕН
IEC 60352-5:2012 ED4