ISO/TS 10303-1688:2010-03 specifies the application module for
Interconnect non planar shape.
The following are within the scope of
ISO/TS 10303-1688:2010-03:
three dimensional manifold surface representation of an interconnect substrate;placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
including changing the planar shape to a manifold shape.
ПОВУЧЕН
ISO/TS 10303-1688:2006
ОБЈАВЉЕН
ISO/TS 10303-1688:2010
90.93
Одлука о потврђивању стандарда
13. 6. 2026.