Објављен
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
ОБЈАВЉЕН
ISO 4825-1:2023
60.60
Стандард објављен
12. 1. 2023.