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Претражите српске, европске и међународне стандарде. Одредите организацију која је доносилац стандарда, изаберите ознаку стандарда или кључну реч и завршите жељену претрагу. Можете додати и фазу у изради стандарда или комитет/комисију која је израдила стандард.
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
60.60
Стандард објављен
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
60.60
Стандард објављен
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
60.60
Стандард објављен
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
60.60
Стандард објављен
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
60.60
Стандард објављен
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
60.60
Стандард објављен
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
60.60
Стандард објављен
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
60.60
Стандард објављен
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
60.60
Стандард објављен
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
60.60
Стандард објављен
Low-pressure sodium vapour lamps - Performance specifications
60.60
Стандард објављен
Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests
60.60
Стандард објављен
Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
60.60
Стандард објављен
Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
60.60
Стандард објављен
Method of measurement of current noise generated in fixed resistors
60.60
Стандард објављен
IEC standard frequencies
60.60
Стандард објављен
High-voltage connecting wire with flame retarding insulation for use in television receivers
60.60
Стандард објављен
Safety of machinery - Electrical equipment of machines - Part 1: General requirements
60.60
Стандард објављен
