Пројекти

Nuclear Power Plants - Instrumentation, control and electrical power systems - Application of simulation techniques

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Backscatter cargo/ vehicle radiographic inspection systems

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Boat-mounted mobile systems for the detection of illicit trafficking of radioactive materials

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<p>Electromagnetic compatibility (EMC) – Test method for measuring of transfer impedance Z_T and screening attenuation a_S or coupling attenuation a_C on of connectors and assemblies up to and above 3 GHz -– Triaxial Ttube in tube method</p>

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Guidance for coupling attenuation and screening attenuation measurement of hybrid cables and assemblies - Triaxial method (IEC 62153-5-x)

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IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew

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Specification of a TD measurement method for twin-axial cables

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Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method

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Radio frequency connectors - Part 1-11: Standardization of magnetic property evaluation methods for non‑magnetic high‑frequency connectors

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Semiconductor device - The recognition criteria of defects in indium phosphide epitaxial wafers - Part 2: Test method for defects using optical microscopy

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Semiconductor device - The recognition criteria of defects in indium phosphide epitaxial wafers - Part 3: Test method for defects using scanning electron microscopy

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Integrated Circuits - Standard roadmap for chiplet ICs

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integrated circuits – Three Dimensional Integrated Circuits Part x: In-line thermal measurement of warpage

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Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages

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IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages

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Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages

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IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

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IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

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