Projects
Search Serbian, European and international standards. Identify the standard organization, select the standard number or keyword, and complete the search you want. You can also add a standard drafting stage or a committee / national committee that drafted the standard
Nuclear Power Plants - Instrumentation, control and electrical power systems - Application of simulation techniques
00.00
Proposal for new project received
Backscatter cargo/ vehicle radiographic inspection systems
10.20
New project ballot initiated
Boat-mounted mobile systems for the detection of illicit trafficking of radioactive materials
10.20
New project ballot initiated
<p>Electromagnetic compatibility (EMC) – Test method for measuring of transfer impedance Z<sub>T</sub> and screening attenuation a<sub>S</sub> or coupling attenuation a<sub>C</sub> on of connectors and assemblies up to and above 3 GHz -– Triaxial Ttube in tube method</p>
00.99
Approval to ballot proposal for new project
Guidance for coupling attenuation and screening attenuation measurement of hybrid cables and assemblies - Triaxial method (IEC 62153-5-x)
00.00
Proposal for new project received
IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew
00.00
Proposal for new project received
Specification of a TD measurement method for twin-axial cables
00.00
Proposal for new project received
Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method
00.99
Approval to ballot proposal for new project
Radio frequency connectors - Part 1-11: Standardization of magnetic property evaluation methods for non‑magnetic high‑frequency connectors
10.20
New project ballot initiated
Semiconductor device - The recognition criteria of defects in indium phosphide epitaxial wafers - Part 2: Test method for defects using optical microscopy
10.20
New project ballot initiated
Semiconductor device - The recognition criteria of defects in indium phosphide epitaxial wafers - Part 3: Test method for defects using scanning electron microscopy
10.20
New project ballot initiated
Integrated Circuits - Standard roadmap for chiplet ICs
00.00
Proposal for new project received
integrated circuits – Three Dimensional Integrated Circuits Part x: In-line thermal measurement of warpage
00.00
Proposal for new project received
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00
Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99
Approval to ballot proposal for new project
Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages
10.20
New project ballot initiated
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00
Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00
Proposal for new project received
