Пројекти

Interconnection of converter-based resources with power systems - Part 10: Framework for the capability and performance of grid forming functions

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Microgrid - Part 3-7: Technical requirements - Data center microgrid monitoring, control, and energy management system

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Technical Specification for Automatic Voltage Control of Power System with Integration of lBR (Inverter based Resource)

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Technical Specification for System Restoration of Interconnected Power Systems Using VSC-HVDC

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Guidelines for assessment of power system resilience

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Railway Applications – Urban Guided Transport Management And Command/Control Systems – Part 4: Interface specifications

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Standardization of Heat-Loss Measurement of ancillary systems to maintain the superconducting state, such as thermal insulation pipe and/or cryostat for superconducting cables and current leads

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Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

10.60   Завршетак изјашњавања о предлогу

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

10.60   Завршетак изјашњавања о предлогу

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

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Thermography test method for printed circuit interconnection defects

10.60   Завршетак изјашњавања о предлогу

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.60   Завршетак изјашњавања о предлогу

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

10.60   Завршетак изјашњавања о предлогу

Circuit Board 2D Barcode Marking Requirements

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Thermal Endurance Test Method for Flexible Optic-Electric Circuit

00.99   Предлог новог пројекта се прихвата

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library

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Noncontact Temperature measurement for LAB using IR camera

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Electrical relay as interface for use in power applications (industrial and residential use)

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