Замењен
Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.
ПОВУЧЕН
IEC PAS 62184:2000 ED1
99.60
Повлачење ступило на снагу
7. 8. 2003.
ОБЈАВЉЕН
IEC 60749-14:2003 ED1