IEC 61191-2:2013 ED2

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Датум објављивања: 5. 6. 2013.

Опште информације

Тренутна фаза: 99.60 Effective date: 23. 5. 2017.

Следећа фаза: WPUB

Иницијатор: IEC

Припада: TC 91

Врста: Међународни стандард

ICS: 31.190 31.240

Језик: енглески француски

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Статус: Ревидиран

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Апстракт

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.

Животни циклус

ПРЕТХОДНО

ПОВУЧЕН
IEC 61191-2:1998 ED1

ТРЕНУТНО

ПОВУЧЕН
IEC 61191-2:2013 ED2
99.60 Повлачење ступило на снагу
23. 5. 2017.

РЕВИДИРАН ОД

ОБЈАВЉЕН
IEC 61191-2:2017 ED3