IEC 61191-2:2017 ED3

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Датум објављивања: 23. 5. 2017.

Опште информације

Тренутна фаза: 60.60 Effective date: 23. 5. 2017.

Иницијатор: IEC

Припада: TC 91

Врста: Међународни стандард

ICS: 31.190 31.240

Језик: енглески француски

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Статус: Објављен

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Апстракт

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.

Животни циклус

ПРЕТХОДНО

ПОВУЧЕН
IEC 61191-2:2013 ED2

ТРЕНУТНО

ОБЈАВЉЕН
IEC 61191-2:2017 ED3
60.60 Стандард објављен
23. 5. 2017.

ИСПРАВКЕ / ИЗМЕНЕ

ОБЈАВЉЕН
IEC 61191-2:2017/COR1:2019 ED3