Објављен
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
ОБЈАВЉЕН
IEC 62047-16:2015 ED1
60.60
Стандард објављен
5. 3. 2015.