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Glavni meni

IEC 62047-16:2015 ED1

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
5. 3. 2015.

Опште информације

60.60     5. 3. 2015.

IEC

TC 47/SC 47F

Međunarodni standard

31.080.99  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62047-16:2015 ED1
60.60 Standard objavljen
5. 3. 2015.