Повучен
ISO/TS 10303-1685:2014-02 specifies the application module for
Interconnect module to assembly module relationship.
The following are within the scope of
ISO/TS 10303-1685:2014-02:
assembly requirement for interconnect substrate;assembly component based symbol placement in substrate requirement;assembly component based annotation text placement in substrate requirement;assembly component feature to layout feature requirement relationship;external references for assembly component;external references for assembly component feature;
ПОВУЧЕН
ISO/TS 10303-1685:2010
ПОВУЧЕН
ISO/TS 10303-1685:2014
95.99
Повучен
18. 12. 2018.
ОБЈАВЉЕН
ISO/TS 10303-1685:2018