ISO/TS 10303-1685:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1685: Application module: Interconnect module to assembly module relationship

Апстракт

ISO/TS 10303-1685:2018-11 specifies the application module for
Interconnect module to assembly module relationship.



The following are within the scope of
ISO/TS 10303-1685:2018-11:


assembly requirement for interconnect substrate;assembly component based symbol placement in substrate requirement;assembly component based annotation text placement in substrate requirement;assembly component feature to layout feature requirement relationship;external references for assembly component;external references for assembly component feature;