Објављен
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
ПОВУЧЕН
ISO 9453:2014
ОБЈАВЉЕН
ISO 9453:2020
90.93
Одлука о потврђивању стандарда
6. 3. 2026.