Published
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
WITHDRAWN
ISO 9453:2014
PUBLISHED
ISO 9453:2020
90.93
Standard confirmed
Mar 6, 2026
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
60.60 Standard published