20.20 12. 10. 2026.
ISO
ISO/TC 206
Међународни стандард
This document defines a method for evaluating effective in-plane thermal conductivity and conductance of a metalized ceramic substrate bearing a heater chip as an imitation of a SiC power semiconductor. The method provides an indicator for in-plane heat transfer properties of metalized ceramic substrates employed in high-power modules.
ПРОЈЕКАТ
ISO/WD 4825-4
20.20
Почетак рада на преднацрту стандарда
12. 10. 2026.