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Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

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Sintering assembly technology - Part 1: Generic description

10.60   Завршетак изјашњавања о предлогу

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

10.60   Завршетак изјашњавања о предлогу

Thermography test method for printed circuit interconnection defects

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Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.60   Завршетак изјашњавања о предлогу

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

10.60   Завршетак изјашњавања о предлогу

Circuit Board 2D Barcode Marking Requirements

10.20   Почетак изјашњавања о предлогу

Thermal Endurance Test Method for Flexible Optic-Electric Circuit

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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library

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Noncontact Temperature measurement for LAB using IR camera

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Electrical Relays – Electromagnetic Compatibility

10.20   Почетак изјашњавања о предлогу

Requirements and roadmap for DC protection function standardisation

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Insulation co-ordination for HVDC system — Part 1: Definitions, principles and rules

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Insulation co-ordination for HVDC system — Part 2: Application guidelines for line commutated converter (LCC) stations

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Guide to the drafting of publications on electromagnetic field exposure assessment methods

30.99   Нацрт комисије стандарда одобрава се за јавну расправу

Information technology – Home Electronic System (HES) application model – GridWise Transactive Energy Framework

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Internet of Things (IoT) – IoT application on power distribution system: Architecture and functional requirements

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(AWI) Internet of Things (IoT) – Environmental and ecological effects, risks, and considerations of underwater acoustic signalling

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