Projects

Search Serbian, European and international standards. Identify the standard organization, select the standard number or keyword, and complete the search you want. You can also add a standard drafting stage or a committee / national committee that drafted the standard

PNW 91-2066 ED1

IEC

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

10.60 Close of voting

TC 91 more

PNW 91-2067 ED1

IEC

Sintering assembly technology - Part 1: Generic description

10.60 Close of voting

TC 91 more

PNW 91-2068 ED1

IEC

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

10.60 Close of voting

TC 91 more

PNW 91-2073 ED1

IEC

Thermography test method for printed circuit interconnection defects

10.60 Close of voting

TC 91 more

PNW 91-2074 ED1

IEC

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.60 Close of voting

TC 91 more

PNW 91-2075 ED1

IEC

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

10.60 Close of voting

TC 91 more