Projekti

Sintering assembly technology - Part 1: Generic description

10.60   Završetak izjašnjavanja o predlogu

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

10.60   Završetak izjašnjavanja o predlogu

Thermography test method for printed circuit interconnection defects

10.60   Završetak izjašnjavanja o predlogu

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.60   Završetak izjašnjavanja o predlogu

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

10.60   Završetak izjašnjavanja o predlogu

Circuit Board 2D Barcode Marking Requirements

10.20   Početak izjašnjavanja o predlogu

Thermal Endurance Test Method for Flexible Optic-Electric Circuit

00.99   Predlog novog projekta se prihvata

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library

00.99   Predlog novog projekta se prihvata

Noncontact Temperature measurement for LAB using IR camera

00.00   Podnet predlog novog projekta

Electrical Relays – Electromagnetic Compatibility

10.20   Početak izjašnjavanja o predlogu

Requirements and roadmap for DC protection function standardisation

00.00   Podnet predlog novog projekta

Insulation co-ordination for HVDC system — Part 1: Definitions, principles and rules

00.99   Predlog novog projekta se prihvata

Insulation co-ordination for HVDC system — Part 2: Application guidelines for line commutated converter (LCC) stations

00.99   Predlog novog projekta se prihvata

Guide to the drafting of publications on electromagnetic field exposure assessment methods

30.99   Nacrt komisije standarda odobrava se za javnu raspravu

Information technology – Home Electronic System (HES) application model – GridWise Transactive Energy Framework

00.99   Predlog novog projekta se prihvata

Internet of Things (IoT) – IoT application on power distribution system: Architecture and functional requirements

00.99   Predlog novog projekta se prihvata

(AWI) Internet of Things (IoT) – Environmental and ecological effects, risks, and considerations of underwater acoustic signalling

00.00   Podnet predlog novog projekta

(AWI) (ISO/IEC TR 40141) Internet of Things (IoT) – Reference architecture guidance

00.00   Podnet predlog novog projekta