Ревидиран
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
ПОВУЧЕН
IEC PAS 62189:2000 ED1
ПОВУЧЕН
IEC 60749-23:2004 ED1
99.60
Повлачење ступило на снагу
9. 12. 2025.
ПОВУЧЕН
IEC 60749-23:2004/AMD1:2011 ED1
ОБЈАВЉЕН
IEC 60749-23:2025 ED2