IEC 61191-2:2017 ED3

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Datum objavljivanja: 23. 5. 2017.

Опште информације

Trenutna faza: 60.60 Effective date: 23. 5. 2017.

Inicijator: IEC

Pripada: TC 91

Vrsta: Međunarodni standard

ICS: 31.190 31.240

Jezik: engleski francuski

Kupovina

Status: Objavljen

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Apstrakt

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.

Životni ciklus

PRETHODNO

POVUČEN
IEC 61191-2:2013 ED2

TRENUTNO

OBJAVLJEN
IEC 61191-2:2017 ED3
60.60 Standard objavljen
23. 5. 2017.

ISPRAVKE / IZMENE

OBJAVLJEN
IEC 61191-2:2017/COR1:2019 ED3