dnaSRPS EN IEC 63287-3:2024

Полупроводничке компоненте – Опште смернице за квалификацију полупроводника – Део 3: Смернице за планове квалификације поузданости енергетских полупроводничких модула

Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module

Апстракт

IEC 63287-3 ED1 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.
Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices.
This document is not intended for medical, military, aeronautics and astronautics-related applications.
NOTE: Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules defined as "isolated or non-isolated semiconductor module with two or more semiconductor chips, according to the package outline style code “MP” specified in IEC 60191‑4".