Ревидиран
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
The contents of the corrigendum of August 2003 have been included in this copy.
ПОВУЧЕН
IEC 60749:1996 ED2
ПОВУЧЕН
IEC 60749:1996/AMD1:2000 ED2
ПОВУЧЕН
IEC 60749:1996/AMD2:2001 ED2
ПОВУЧЕН
IEC PAS 62163:2000 ED1
ПОВУЧЕН
IEC 60749-3:2002 ED1
99.60
Повлачење ступило на снагу
3. 3. 2017.
ПОВУЧЕН
IEC 60749-3:2002/COR1:2003 ED1
ОБЈАВЉЕН
IEC 60749-3:2017 ED2