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Glavni meni

IEC 60749-3:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
9. 4. 2002.

Опште информације

99.60     3. 3. 2017.

WPUB   

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski   španski  

Kupovina

Revidiran

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Apstrakt

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

The contents of the corrigendum of August 2003 have been included in this copy.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749:1996 ED2

POVUČEN
IEC 60749:1996/AMD1:2000 ED2

POVUČEN
IEC 60749:1996/AMD2:2001 ED2

POVUČEN
IEC PAS 62163:2000 ED1

TRENUTNO

POVUČEN
IEC 60749-3:2002 ED1
99.60 Povlačenje stupilo na snagu
3. 3. 2017.

ISPRAVKE / IZMENE

POVUČEN
IEC 60749-3:2002/COR1:2003 ED1

REVIDIRAN OD

OBJAVLJEN
IEC 60749-3:2017 ED2