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SRPS EN 62258-2:2013

Semiconductor die products - Part 2: Exchange data formats

Jan 28, 2013

General information

90.93     Dec 15, 2025

90.00    Dec 15, 2030

ISS

N022

European Norm

31.080.99  

English  

plan 2012.

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Scope

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Life cycle

NOW

PUBLISHED
SRPS EN 62258-2:2013
90.93 Standard confirmed
Dec 15, 2025

Related project

Adopted from EN 62258-2:2011

Adopted from EN 62258-2:2011