Projects

Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters

60.60   Standard published

Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

60.60   Standard published

Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

60.60   Standard published

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

60.60   Standard published

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

60.60   Standard published

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

60.60   Standard published

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

60.60   Standard published

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

60.60   Standard published

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

60.60   Standard published

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

60.60   Standard published

Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

60.60   Standard published

Semiconductor devices - Mechanical and climatic test methods - Part 1: General

60.60   Standard published

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly

60.60   Standard published

Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

60.60   Standard published

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

60.60   Standard published

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

60.60   Standard published

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

60.60   Standard published

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

60.60   Standard published