Projects

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

60.60   Standard published

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

60.60   Standard published

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

60.60   Standard published

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

60.60   Standard published

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

60.60   Standard published

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

60.60   Standard published

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

60.60   Standard published

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

60.60   Standard published

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

60.60   Standard published

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

60.60   Standard published

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

60.60   Standard published

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

60.60   Standard published

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

60.60   Standard published

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

60.60   Standard published

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

60.60   Standard published

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

60.60   Standard published

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

60.60   Standard published

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

60.60   Standard published