Projects
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Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
50.60
Close of voting. Proof returned by secretariat
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
50.60
Close of voting. Proof returned by secretariat
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
50.60
Close of voting. Proof returned by secretariat
Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate
40.20
DIS ballot initiated: 12 weeks
Fibre optic interconnecting devices and passive components - Fibre optic isolators - Part 1: Generic specification
40.60
Close of voting
Aerospace series - Blind bolt, 130° flush head, high strength
50.20
Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Nuclear power plants - Instrumentation, control and electrical power systems - Requirements for static uninterruptible DC and AC power supply systems
40.60
Close of voting
Rubber or plastics covered rollers — Specifications — Part 3: Dimensional and geometrical tolerances
10.99
New project approved
Live working - Portable equipment for earthing or earthing and short-circuiting
10.99
New project approved
Live working - Saddles, stick clamps and their accessories
10.99
New project approved
Live working - Voltage detectors - Part 6: Guidelines on non-contact voltage detectors (NCVD) for use at nominal voltages above 1 kV AC
10.99
New project approved
Artificial pollution tests on high-voltage ceramic and glass insulators to be used on d.c. systems
10.99
New project approved
Corrigendum 1 - Artificial pollution tests on high-voltage ceramic and glass insulators to be used on d.c. systems
10.99
New project approved
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
40.60
Close of voting
Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
40.60
Close of voting
Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
40.60
Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad
50.60
Close of voting. Proof returned by secretariat
Aerospace series - Blind bolt, 100° reduced flush head, high strength
50.20
Proof sent to secretariat or FDIS ballot initiated: 8 weeks
