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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
60.60
Standard published
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
60.60
Standard published
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
60.60
Standard published
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
60.60
Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
60.60
Standard published
