Projects

Assessment of circular content in products - Part 3: Proportion of recycled materials (Proposed Horizontal Publication)

40.00   DIS registered

Electronic displays for special applications - Part 4: Public information and signage

20.99   WD approved for registration as CD

Electronic displays for special applications - Part 5: Review of relevance of display standards to automotive application

20.99   WD approved for registration as CD

Low-voltage auxiliary power systems - Part 2-1: Design criteria - General requirements

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Low-voltage auxiliary power systems - Part 2-2: Design criteria - Low-voltage DC auxiliary power systems for substations

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Smart city use case collection and analysis - Managing public health emergencies in smart cities - Part 2 : Use case analysis

60.00   Standard under publication

Systems Reference Deliverable (SRD) - Use Case Collection and Analysis - Management of Public Health Emergencies in Smart Cities - Part 2: Use Case Analysis

20.99   WD approved for registration as CD

Guideline for the planning and design of direct current or hybrid microgrids

20.99   WD approved for registration as CD

Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 2: Transient conditions

30.20   CD study/ballot initiated

Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 3: dynamic conditions

20.99   WD approved for registration as CD

Semiconductor devices - Semiconductor devices for IoT system - Part 2: Test method of semiconductor photon sources incorporating human factors for wearable equipment

30.99   CD approved for registration as DIS

Carbon footprint calculation applicable to industrial lithium-ion batteries - Part 1: General requirements and methodology

60.00   Standard under publication

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

40.20   DIS ballot initiated: 12 weeks

Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages

40.20   DIS ballot initiated: 12 weeks

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

50.99   FDIS or proof approved for publication

Hybrid CPV/PV modules: General characteristics and measurement procedures - Part 1: Performance measurements and power rating - Irradiance and temperature

50.00   Final text received or FDIS registered for formal approval

Technical Specifications for Digitalization of Operation and Maintenance in Hydropower Assets

20.99   WD approved for registration as CD

Sustainable management of waste electrical and electronic equipment (e-waste) (Proposed Horizontal Publication)

50.60   Close of voting. Proof returned by secretariat