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Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-6: Special requirements for testing of metal halide perovskite-containing photovoltaic (PV) modules

20.99   WD approved for registration as CD

TC 82 more

Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 2: Test procedures

20.99   WD approved for registration as CD

TC 82 more

Nuclear power plants - Control rooms - Operator controls

30.99   CD approved for registration as DIS

TC 45/SC 45A more

Amendment 1 - Compression and mechanical connectors for power cables - Part 1-1: Test methods and requirements for compression and mechanical connectors for power cables for rated voltages up to 1 kV (U<sub>m</sub> = 1,2 kV) tested on non-insulated conductors

20.99   WD approved for registration as CD

TC 20 more

Amendment 1 - Compression and mechanical connectors for power cables - Part 1-2: Test methods and requirements for insulation piercing connectors for power cables for rated voltages up to 1 kV (U<sub>m</sub> = 1,2 kV) tested on insulated conductors

20.99   WD approved for registration as CD

TC 20 more

Amendment 1 - Compression and mechanical connectors for power cables - Part 1-3: Test methods and requirements for compression and mechanical connectors for power cables for rated voltages above 1 kV (U<sub>m</sub> = 1,2 kV) up to 30 kV (U<sub>m</sub> = 36 kV) tested on non-insulated conductors

20.99   WD approved for registration as CD

TC 20 more

Nuclear instrumentation - Portable gamma radiation meters and spectrometers used for prospecting - Definitions, requirements and calibration

40.20   DIS ballot initiated: 12 weeks

TC 45 more

Determination of long-term radiation ageing in polymers - Part 1: Techniques for monitoring diffusion-limited oxidation

30.20   CD study/ballot initiated

TC 112 more

Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

40.99   Full report circulated: DIS approved for registration as FDIS

TC 91 more

Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

30.99   CD approved for registration as DIS

TC 91 more

Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

30.20   CD study/ballot initiated

TC 91 more

Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad

60.00   Standard under publication

TC 91 more

Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

20.99   WD approved for registration as CD

TC 91 more

Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

20.99   WD approved for registration as CD

TC 91 more

Materials for circuit boards and other interconnecting structures - Part 3-9: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

20.99   WD approved for registration as CD

TC 91 more

Nuclear power plants - Instrumentation and control systems important to safety - Detection of leakage in coolant systems

50.99   FDIS or proof approved for publication

TC 45/SC 45A more

Electrical insulating materials and systems - Part 2: DC voltage endurance evaluation

30.60   Close of voting/ comment period

TC 112 more

Amendment 1 - Fibre-optic communication subsystem test procedures - Part 4-2: Installed cabling plant - Single-mode attenuation and optical return loss measurements

40.20   DIS ballot initiated: 12 weeks

TC 86/SC 86C more