Projects

Application of IEC 63339 to Smart Manufacturing Reference Models

50.00   Final text received or FDIS registered for formal approval

Application of IEC 63339 to smart manufacturing reference models

30.99   CD approved for registration as DIS

Plugs, socket-outlets, ship couplers for low-voltage shore connection systems (LVSC-systems) in Direct Current (DC)

30.20   CD study/ballot initiated

Guidelines for joint control for hydroelectric power plants

20.99   WD approved for registration as CD

Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test

40.00   DIS registered

Arc hazards and safety aspects in LVDC power distribution system – Part 1: Series arc characteristics between brass and copper-alloy electrodes

30.60   Close of voting/ comment period

Performance of power electronic transformer for flexible transmission and distribution systems

50.00   Final text received or FDIS registered for formal approval

Grid compliance test for photovoltaic power plants

20.99   WD approved for registration as CD

Hazard analysis due to using C-UAS system in nuclear site

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Quantum technologies – Terminology and quantities – General quantities

20.99   WD approved for registration as CD

Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 1: Mechanical reliability under shock

40.60   Close of voting

Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 2: Temperature and humidity

30.60   Close of voting/ comment period

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant

30.99   CD approved for registration as DIS

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements

40.00   DIS registered

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples

30.60   Close of voting/ comment period

Augmented and mixed reality equipment and systems – Technology and standards review and gap analysis

50.00   Final text received or FDIS registered for formal approval

VR/AR/MR Systems and Equipment – Glossary of terms

30.60   Close of voting/ comment period

VR/AR/MR Systems and Equipment – Consumer VR/AR/MR devices - Part 1: Reference model

20.99   WD approved for registration as CD