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Qi Specification - Version 2.3 - Part 12: Active alignment system (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 13: Thermal management protocol (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 2: Power profiles (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 3: Power delivery (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 4: NFC Tag protection (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 5-1: MPP Communications protocol (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 5-2: MPP - Power delivery (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 5-3: MPP - Magnetics design (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 5-4: MPP - Foreign object detection (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 5-5: MPP - Design guidelines (Informative) (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 5-6: MPP - Communications physical layer (Informative) (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 6: Mechanical, thermal, user interface (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 7: Magnetic covers (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 8: Foreign object detection (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Qi Specification - Version 2.3 - Part 9: Communications protocol (Fast Track)

40.20   DIS ballot initiated: 12 weeks

TC 100 more

Testing methods for equivalent converter impedance at AC side of voltage source converters (VSC) for high voltage direct current (HVDC) systems

30.60   Close of voting/ comment period

TC 22/SC 22F more

Quantum technologies – Quantum communication – Influence of transmission media on the implementation of quantum communication

20.99   WD approved for registration as CD

IEC/ISO JTC 3 more

Thermography test method for defects circuit interconnection defects

30.20   CD study/ballot initiated

TC 91 more