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IEC 61189-2-803:2023 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Jul 26, 2023

General information

60.60     Jul 26, 2023

IEC

TC 91

International Standard

31.180  

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Scope

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

Life cycle

NOW

PUBLISHED
IEC 61189-2-803:2023 ED1
60.60 Standard published
Jul 26, 2023

National adoptions

SRPS EN IEC 61189-2-803:2023  
ISS

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

60.60   Standard published

N040 more