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IEC 61249-2-54 ED1

Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

General information

40.99     May 8, 2026

DECFDIS    May 14, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61249-2-54 ED1
40.99 Full report circulated: DIS approved for registration as FDIS
May 8, 2026

National adoptions

naSRPS EN IEC 61249-2-54:2024  
ISS

Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

40.60   Close of voting

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