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IEC 63567-3 ED1

Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light

General information

40.20     Sep 11, 2026

PRVC    Dec 4, 2026

IEC

TC 47

International Standard

31.080.99  

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NOW

PROJECT
IEC 63567-3 ED1
40.20 DIS ballot initiated: 12 weeks
Sep 11, 2026

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Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light

40.20   DIS ballot initiated: 12 weeks

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