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IEC 61249-2-55 ED1

Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

General information

30.60     Sep 12, 2025

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61249-2-55 ED1
30.60 Close of voting/ comment period
Sep 12, 2025

National adoptions

prSRPS EN IEC 61249-2-55:2025  
ISS

Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

10.99   New project approved

N040 more