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IEC 61249-2-55 ED1

Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

General information

30.99     Jan 30, 2026

TCDV    Mar 27, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61249-2-55 ED1
30.99 CD approved for registration as DIS
Jan 30, 2026

National adoptions

prSRPS EN IEC 61249-2-55:2025  
ISS

Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

10.99   New project approved

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