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IEC 62878-2-604 ED1

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

General information

30.99     Aug 7, 2026

TCDV    Dec 17, 2026

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

PROJECT
IEC 62878-2-604 ED1
30.99 CD approved for registration as DIS
Aug 7, 2026

National adoptions

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

10.99   New project approved

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