IEC 60947-7: 2026 specifies requirements for PCB terminal blocks primarily intended for industrial or similar use.
Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board.
This document applies to PCB terminal blocks intended to connect round copper conductors, with or without special preparation, having a cross-section between 0,05 mm2 and 300 mm2/AWG 28-600 kcmil, intended to be used in circuits of a rated voltage not exceeding 1 000 V AC up to 1 000 Hz or 1 500 V DC.
NOTE 1 AWG is the abbreviation of “American Wire Gage” (Gage (US) = Gauge (UK)).
1 kcmil = 1 000 cmil;
1 cmil = 1 circular mil = surface area of a circle having a diameter of 1 mil;
1 mil = 1/1 000 inch.
NOTE 2 Large-cross-section terminal blocks are dedicated to the specific design of high-current PCBs. The range up to 300 mm2 is kept to cover any possible application. Examples of high current PCBs and PCB terminal blocks are shown in Annex C.
This document can be used as a guide for special types of PCB terminal blocks with components, such as disconnect units, integrated cartridge fuse-links and the like or with other dimensions of conductors.
If applicable, in this document the term “clamping unit” is used instead of “terminal”. This is taken into account in the case of references to IEC 60947-1:2020.
This third edition cancels and replaces the second edition published in 2019. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) additional test for PCB terminal blocks with clamping units, where contact pressure is transmitted through insulating materials;
b) tightening torques for screws now given in Table 3 (previously given in IEC 60947-1:2020, Table 4); tightening torques added for an additional type of screw;
c) new criteria for verification of contact resistance introduced;
d) clarification in the description of the temperature-rise test (current-temperature derating); corrections in the test sequence according to Figure 4.
