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PNW 47D-1008 ED1

Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages

General information

10.20     Apr 3, 2026

PRVN    Jun 26, 2026

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

PROJECT
PNW 47D-1008 ED1
10.20 New project ballot initiated
Apr 3, 2026