Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

ISO/TS 10303-1716:2010

Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template

Sep 3, 2010
95.99   Withdrawal of Standard   Nov 18, 2014

General information

95.99     Nov 18, 2014

ISO

ISO/TC 184/SC 4

Technical Specification

25.040.40  

English  

Buying

Withdrawn

Language in which you want to receive the document.

Scope


ISO/TS 10303-1716:2010-07 specifies the application module for
Layered interconnect complex template.



The following are within the scope of
ISO/TS 10303-1716:2010-07:



footprint definition;
footprint definition shape;
padstack definition;
padstack definition shape;
items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.

Life cycle

PREVIOUSLY

WITHDRAWN
ISO/TS 10303-1716:2010

NOW

WITHDRAWN
ISO/TS 10303-1716:2010
95.99 Withdrawal of Standard
Nov 18, 2014

REVISED BY

WITHDRAWN
ISO/TS 10303-1716:2014