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ISO/WD 4825-3

Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for thermal property measurements of metalized ceramic substrates — Part 3: Evaluation of heat transfer characteristic of metalized ceramic substrates in the horizontal direction for use in power modules

General information

20.20     May 22, 2026

ISO

ISO/TC 206

International Standard

Scope

This document defines a method for evaluating effective in-plane thermal conductivity and conductance of a metalized ceramic substrate bearing a heater chip as an imitation of a SiC power semiconductor. The method provides an indicator for in-plane heat transfer properties of metalized ceramic substrates employed in high-power modules.

Life cycle

NOW

PROJECT
ISO/WD 4825-3
20.20 Working draft (WD) study initiated
May 22, 2026