ISO/WD 4825-5

Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for thermal property measurements of metalized ceramic substrates — Part 5: Transient thermal characterization for double-sided cooling power module

Scope

Transient thermal measurement is used to yield the structure function, represented by Cauer model thermal network from junction to ambient. Structure function represents the three-dimensional heat conduction from the junction to the ambient, by the integral of the thermal resistance and the thermal capacitance from junction to the ambient, in a direction perpendicular to the iso-surfaces [2, 3]. For single-sided cooling modules, the direction of "thermal network from the heat source to the heat sink" was almost identical to the "one-dimensional Cauer thermal network represented by structure function showing the direction normal to the iso-surfaces. This article characterizes the thermal parameter for a double-sided cooling module, which is performed using the fact that structure function originally represents three-dimensional heat dissipation. Non-destructive fatigue analysis is shown as an example of the use-case of the calibrated model.