Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

SRPS EN IEC 63378-3:2026

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

Jan 30, 2026

General information

60.60     Jan 30, 2026

ISS

N022

European Norm

31.080.01  

English  

Buying

Published

Language in which you want to receive the document.

Scope

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.

This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

Life cycle

NOW

PUBLISHED
SRPS EN IEC 63378-3:2026
60.60 Standard published
Jan 30, 2026

Related project

Adopted from EN IEC 63378-3:2025 IDENTICAL

Adopted from IEC 63378-3:2025 ED1 IDENTICAL